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Reliability and Failure Analysis of Electronics and Mechanical Systems
Organized by
Ouk Sub Lee
This session includes 5 papers concerning
reliability of solder joint and mechanical elements such as plastics, thin
films and buried pipelines. The thermal fatigue and stress are considered as
the main factors threatening the reliability of solder joint. The probability
of failure is estimated by using the FORM to judge the reliability of solder
joint and buried pipeline. We would like to discuss about the more rigorous
approaches to assess varying mechanical elements.
Session Organizer: Ouk Sub Lee
Phone: 032-860-7315, FAX: 032-868-1716, E-mail: leeos@inha.ac.kr
Session Chair: Ouk Sub Lee
Session
Co-chair: Soon-Bok Lee
KAIST, Daejeon
305-701,
Phone: 42-869-3029, FAX: 42-869-3095, E-mail:sblee@kaist.ac.kr
Papers
1.
The mechanistic modeling of
the thermal fatigue behavior in the lead-free solder
Corresponding
author: Soon-Bok Lee
KAIST, Daejeon
305-701,
Phone: 42-869-3029, FAX:42-869-3095, E-mail:sblee@kaist.ac.kr
Co-authors LHO KIM and Tae-Sang Park
2.
Reliability estimation of
solder joint by accelerated life tests
Corresponding
author: Ouk Sub Lee
Phone: 032-860-7315, FAX: 032-868-1716, E-mail: leeos@inha.ac.kr
Co-authors:No Hoon Myoung and Dong Hyeok
Kim
3.
Analysis of engineering plastic behaviors in
thermal stress condition by using ESPI technique: Electronics part and
structure
Corresponding
author: Sinil Ham
Samsung
Electronics Co., Ltd, Gyeonggi-do 442-742,
Phone: 031-200-4629, FAX: 031-200-2165, E-mail: si.ham@Samsung.com
Coauthors: Jae Huk
Lee and Sang
4. Risk
analysis of buried pipeline using probabilistic method
Corresponding Author: Ouk Sub Lee
Phone: 032-860-7315, FAX: 032-868-1716, E-mail: leeos@inha.ac.kr
Co-authors: Dong Hyeok Kim and No Hoon
Myoung
5. Mechanical
characterization of Al thin film for MEMS application
Corresponding Author: Soon-Bok Lee
KAIST, Daejeon
305-701, Korea
Phone: 42-869-3029, FAX: 42-869-3095, E-mail:sblee@kaist.ac.kr
Co-authors: Dong-Cheon Baek and Sung-Yeol
Kim
6. Application of the New Static Photoelastic
Experimental Hybrid Method with New Numerical Method to the Plane Fracture
Mechanics
Corresponding
Author: Jay Sug Hawong
Phone:
011-544-2445, FAX 053-813-3703, E-mail:jshawong@yumail.ac.kr
Co-author: K. Tche
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