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Cracks in Micro- and Nanoelectronics

Organized by

B. Michel

The session deals with crack evaluation and reliability of micro- and nanoelectronic components and systems. Special attention will be given to the combined theoretical and experimental approach. Microdeformation and nanodeformation analysis and crack characterization will be discussed taking into account both classical and advanced experimental techniques. The evaluation of cracks and fracture behaviour in nanotechnology applications (“nanoreliability”, “nanomaterials”) is a special topic of this session.

Session Organizer: B. Michel

Address: Fraunhofer Institute IZM Berlin, Germany

Phone: 0049-30-46403-200 FAX: 0049-30-46403-211

E-mail: bernd.michel@izm.fraunhofer.de

Session Chair: Bernd Michel

Session/ Co-chair: O.Wittler

Technical University of Berlin, Germany

Phone: 0049-30-46403-247, FAX: 0049-30-46403-211 E-mail: wittler@izm.fhg.de

Papers

1. A new method for local strain field analysis near cracks in micro-

and nanotechnology applications

Corresponding Author: Bernd Michel

Co-authors:

D. Vogel: Fraunhofer Institute IZM, Berlin, Germany

N. Sabaté: University of Barcelona, Spain

D. Lieske: Infineon AG, Dresden, Germany

2. Simulation of interface cracks in microelectronic packaging

Corresponding Author: J. Auersperg

AMIC GmbH, Volmerstraße 9B, D-12489 Berlin, Germany

Phone: 0049-30-46403-214, FAX: 0049-30-46403-211

E-mail: juergen.auersperg@izm.fraunhofer.de

Co-authors:

R. Dudek: Fraunhofer Institute IZM Chemnitz, Germany

3. Experimental investigations for fracture analysis of solder joints in microelectronic and MEMS applications

Corresponding Author: H. Walter

AMIC GmbH, Volmerstraße 9B, D-12489 Berlin, Germany

Phone: 0049-30-46403-184 FAX: 0049-30-46403-211

E-mail: hans.walter@izm.fraunhofer.de

Co-authors:

C. Bombach, Nanotest und Design GmbH Berlin, Germany

W. Faust, Fraunhofer Institute IZM, Chemnitz, Germany

B. Michel, Fraunhofer Institute IZM, Berlin, Germany

4. Simulation of deformation and fracture behaviour in microelectronic packaging

Corresponding Author: O. Wittler

TU Berlin, FSP Technologien der Mikroperipherik, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany

Phone: 0049-30-46403-211, FAX: 0049-30-46403-211

E-mail: olaf.wittler@izm.fraunhofer.de

Co-authors:

B. Wunderle: Fraunhofer Institute IZM Berlin, Germany

E. Dermitzaki: Heriot Watt University, Edinburgh, UK

5. Title: AFM based fracture analysis in micro- and nanomaterials

Corresponding Author: J. Keller

Berliner Nanotest und Design GmbH, Volmerstraße 9, 12489 Berlin, Germany

Phone: 0049-30-46403-211, FAX: 0049-30-46403-211

E-mail: juergen.keller@izm.fraunhofer.de

Co-authors:

A. Gollhardt: Fraunhofer Institute IZM, Berlin, Germany

D. Vogel: Fraunhofer Institute IZM, Berlin, Germany

B. Michel: Fraunhofer Institute IZM, Berlin, Germany

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