Interfacial Fracture
in Composites and Electronic Packaging Materials
Organized by
C.T. Sun and T. Ikeda
Organizers: C.T. Sun (Purdue University, USA, sun@purdue.edu)
Toru Ikeda (Kyoto University, Japan, ikeda@mech.kyoto-u.ac.jp)
Papers
1) Three-dimensional stress intensity factors
analyses of interface cracks
between dissimilar anisotropic materials
Masaki Nagai, Toru Ikeda* and Noriyuki Miyazaki
* Department of Mechanical Engineering
Graduate School of Engineering, Kyoto University
E-mail: ikeda@mech.kyoto-u.ac.jp
2) Significance
of K-dominance in delamination cracking in
composite laminates
C. T. Sun* and Z. Yang
*School of Aeronautics and Astronautics, Purdue University
West Lafayette, Indiana 47907, USA
Email: sun@purdue.edu
3) Interaction between an interfacial penny
shaped crack and a center of dilatation in viscoelastic
bimaterial
KT Chau*, YZ Sun and RCK Wong
*Department of Civil and Structural
Engineering, Polytechnic University
Kowloon, Hong Kong
Email: cektchau@polyu.edu.hk
4) Three-dimensional thermal stress
analysis considering the stress singularity for bonded structures
Hideo Koguchi*
* Department of Mechanical Engineering, Nagaoka
University of Technology
E-mail: koguchi@mech.nagaokaut.ac.jp
5) Failure analysis of adhesively
bonded structures: from coupon level data to structural level predictions and
verification
De Xie,
A. Waas*, K. Shahwan,
J. Schroeder and R. Boeman
*
Department of Aerospace Engineering, University of Michigan
FXB 3044, 1320 Beal Street, Ann Arbor,
MI 48109-2140
Email: dcw@engin.umich.edu
6) Investigation of the face-core
interface characteristics of sandwich
composites with nanophased cores
Hassan Mahfuz*, Mohammed F. Uddin, Leif Carlsson, and Shaik Jeelani
*Department of Ocean
Engineering
Flirida Atlantic University, Sea Tech Campus, 101 North Beach Road
Dania Beach, Florida 33004-3023, USA
Email:
hmahfuz@fau.edu
7) Molecular dynamics of interfacial fracture
T.E.Tay*, V.B.C.Tan, M. Deng, and G.F. Wang
*Department of Mechanical and Production Engineering
The National University of Singapore, 10 Kent Ridge Cresent, Singapore
Email: mpetayte@nus.edu.sg
8) Fracture analysis on the popcorning of plastic packages during the solder reflow process
Ricky Lee*,
John Lau, and Dennis Lau
*Department of Mechanical Engineering,
Hong Kong University of Science and Technology, Kowloon, Hong Kong
Email:
rickylee@ust.hk
9) Evaluation of interface toughness
between submicron island and substrate
Hiroyuki Hirakata*, Shohei
Matsumoto and Takayuki Kitamura
* Department of Engineering Physics and Mechanics
Graduate School of Engineering, Kyoto University
E-mail: hirakata@kues.kyoto-u.ac.jp
10) Reliability of interfaces between
components in advanced electronic packages under solder reflow
process
Toru Ikeda* and Noriyuki Miyazaki
* Department of Mechanical Engineering
Graduate School of Engineering, Kyoto University
Yoshida Honmachi, Sakyo-ku,
Kyoto 606-8501, Japan
E-mail: ikeda@mech.kyoto-u.ac.jp, Tel.:
075-753-5215
11) Investigation of the face-core interface characteristics of sandwich
composites with nanophased cores
Hassan Mahfuz*, Mohammed F. Uddin, Leif Carlsson, and Shaik Jeelani
*Department of Ocean
Engineering
Florida Atlantic University, Sea Tech Campus, 101 North Beach Road
Dania Beach, Florida 33004-3023 USA
Email: hmahfuz@fau.edu
12) Delamination of pb-free flipchip underfill during 2nd level
interconnect reflow
Seungbae Park*, Soonwan Chung, and Zhenming Tang
* Department of Mechanical Engineering
State University of New York at Binghamton
PO Box 6000
Binghamton, NY 13902
E-mail: sbpark@binghamton.edu
Tel: 607-777-3415